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EXTEC ® High Concentration Diamond Wafering Blades---高密度钻石切割碟
货号 |
描述 |
包装 |
推荐用途:金属基复合材料、钛、热喷涂涂料、印刷电路板、骨头。 |
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12200 |
3" Dia. x 0.006" Thickness x 1/2” Arbor (76 mm x 0.15 mm x 12.7 mm) |
Each |
12205 |
4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm) |
Each |
12210 |
5" Dia. x 0.015" Thickness x 1/2” Arbor (127 mm x 0.4 mm x 12.7 mm) |
Each |
12215 |
6" Dia. x 0.020" Thickness x 1/2” Arbor (152 mm x 0.5 mm x 12.7 mm) |
Each |
12220 |
7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm) |
Each |
12218 |
8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm) |
Each |
推荐用途:难切割的,磁性材料和非磁性材料。 |
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12252 |
5" Dia. x 0.020" Thickness x 1/2” Arbor (127 mm x 0.5 mm x 12.7 mm) |
Each |
12253 |
7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm) |
Each |
12254 |
8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm) |
Each |
EXTEC ® High Concentration EP Diamond Wafering Blades---EP型高密度钻石切割碟
货号 |
描述 |
包装 |
推荐用途:高分子材料,橡胶,软性、黏性材料。 |
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12222 |
4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm) |
Each |
12224 |
5" Dia. x 0.020" Thickness x 1/2” Arbor (127 mm x 0.5 mm x 12.7 mm) |
Each |
12226 |
7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm) |
Each |
12228 |
8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm) |
Each |